International Conference on Electronic Engineering and Informatics

The International Conference on Electronic Engineering and Informatics (EEI 2026) is set to take place in Jinan, Shandong, China. This prestigious event will convene experts and researchers from June 26 to June 28, 2026, and aims to explore the latest advancements in electronic engineering, informatics, and computer science. The conference is designed to contribute to the national digital economy and intelligent transformation strategy, addressing significant challenges and research directions prevalent in these fields. Participants will engage in high-level discussions, share research findings, and expand their professional networks, fostering collaborations that can lead to innovative solutions and applications in both academic and industrial settings.EEI 2026 will feature a range of topics for submission, including but not limited to 3D process and integration technology, substrate embedding and advanced flip chip packaging, design and analysis of transmission systems, as well as new materials and 3D interconnection. Other areas of interest encompass wearable, flexible, and stretchable electronics, optical interconnection and 3D photonics, digital system and logic design, signal processing for wireless communication, cognitive radio and software radio, and radar signal and data processing. The conference provides a platform for attendees to present their original research, exchange innovative ideas, and discover potential global partners for future endeavors. Ethical conduct is emphasized, with strict guidelines against plagiarism and misconduct, ensuring that all submissions are original and not under consideration elsewhere.