AES CONVENTION

Exhibition Scale: Less than 10,000. The Audio Engineering Society invites audio researchers and practitioners from academia and industry to the AES Conference, which focuses on artificial intelligence and machine learning as it applies to audio. This 3-day event aims to bring the community together to educate, showcase, and advance state-of-the-art technologies. It will feature keynote speakers, workshops, tutorials, challenges, and cutting-edge peer-reviewed research. The scope is broad – expecting participants from all types of institutions, including academia, industry, or pure research, with diverse disciplinary perspectives – but united by a focus on AI and machine learning for audio.

The AES CONVENTION in Warsaw, Poland, features a wide range of exhibits covering various cutting-edge fields of professional audio technology. Specifically, the exhibition focuses on the latest developments in audio science and engineering, encompassing multiple levels from fundamental research to practical applications. Core exhibits and technical topics include: spatial audio and immersive experiences, such as Dolby Atmos, DTS:X, and 3D audio solutions for virtual reality (VR) and augmented reality (AR); networked audio technologies, highlighting the integrated application of protocols like Dante, AES67, and RAVENNA in live sound reinforcement, recording studios, and broadcast systems; audio measurement and analysis, including the latest acoustic testing software, hardware devices, and loudness standardization tools. Furthermore, the exhibition delves into the application of artificial intelligence and machine learning in audio engineering, such as intelligent audio separation, automatic mixing, speech recognition, and synthesis. Other important areas include automotive audio systems, public address and sound reinforcement technology, digital audio archiving and restoration, audio encoding and decoding technologies (e.g., MPEG-H), and audio forensics. Exhibitors will showcase the latest microphones, mixing consoles, processors, loudspeaker systems, audio interfaces, and related software products.

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