NEPCON JAPAN (SEPTEMBER)

Exhibition Scale: 50,000-10,000. Asia's largest exhibition for electronic design, R&D, and manufacturing technology. NEPCON JAPAN has grown together with the Japanese and Asian electronics industries. This exhibition consists of six specialized shows focusing on key areas of electronic manufacturing and R&D, enhancing its value as Asia's leading one-stop exhibition for the electronics industry. The 2021 Japan Electronic Components & Manufacturing Equipment Exhibition is Asia's largest exhibition for electronic design, R&D, and manufacturing technology. Numerous innovations in the electronic manufacturing industry are showcased annually at the Tokyo Electronic Components Exhibition. The NEPCON JAPAN International Electronic Components & Manufacturing Equipment Exhibition consists of seven professional exhibitions and technical conferences, covering fields such as SMT, IC packaging, PCB/PWB, measurement/analysis, electronic components/materials, and precision processing. As a comprehensive exhibition for "electronic packaging & manufacturing," NEPCON JAPAN has continuously grown since its inception in 1972, paralleling the development of the Japanese electronics industry. In 2000, the exhibition added sections for IC packaging technology, printed circuit boards, and electronic components, further enhancing its value and making it an "international comprehensive exhibition for electronic R&D, design, and manufacturing." In recent years, based on this scale, new concurrent exhibitions have been added focusing on promising areas such as automotive electronics, electric vehicles, LED/OLED lighting technology, and wearable electronic products. NEPCON JAPAN is highly regarded by the industry as an excellent venue for understanding new technologies in the "future electronics industry."

Semiconductor Technology: Semiconductor materials, manufacturing equipment, testing equipment, packaging technology, MEMS technology; Electronic Components: Capacitors, resistors, connectors, sensors, switches, relays, power supplies, display devices, PCB/FPC, optoelectronic devices, acoustic devices, RF devices; Electronic Manufacturing Equipment: SMT equipment, welding equipment, dispensing equipment, test and measurement equipment, automated assembly equipment, cleanroom equipment, anti-static products; Materials: Conductive materials, insulating materials, packaging materials, thermal management materials, adhesives; Software and Services: EDA tools, PLM systems, MES systems, IoT solutions, AI applications in electronic manufacturing; Others: EMS/ODM services, electronic product design, R&D services, industry associations and media.

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