2026 JPCA Show Electronic Circuit and Packaging Exhibition, Tokyo, Japan

The 2026 JPCA Show in Tokyo, Japan, Electronic Circuits and Packaging Exhibition, organized by the Japan Printed Circuit Association (JPCA), is an annual international event and one of the most influential and longest-running professional exhibitions in the Asian and global electronics manufacturing industry. Since its inception, the exhibition has consistently aimed to promote innovation and development in electronic circuit and packaging technologies, providing a platform for industry professionals to comprehensively understand the latest technologies, products, and solutions. The exhibition is grand in scale, attracting tens of thousands of professional visitors and hundreds of exhibiting companies each year, including leading global electronics manufacturers, R&D institutions, material suppliers, equipment manufacturers, and service providers. The exhibition not only showcases the latest technologies and products across the entire value chain, from electronic circuit design, manufacturing, and assembly to testing, but also fosters international technical exchange and cooperation through a series of high-level seminars, technical presentations, and industry forums. With its forward-looking and professional nature, the JPCA Show has become a barometer for technological development trends in the electronics industry, playing a pivotal role in promoting the technological progress and market development of the global electronics industry. Exhibitors and visitors can establish extensive business contacts, explore new cooperation opportunities, collectively address industry challenges, and seize future development opportunities.

The exhibit range of the 2026 JPCA Show in Tokyo, Japan, Electronic Circuits and Packaging Exhibition, covers various critical aspects of electronic circuit and packaging technologies, aiming to comprehensively showcase the industry's cutting-edge innovative achievements and solutions. Specific exhibits include, but are not limited to: 1. **Printed Circuit Board (PCB) Manufacturing and Materials:** Covering manufacturing equipment, process technologies, and related materials for various rigid PCBs, flexible PCBs, rigid-flex PCBs, HDI boards, and packaging substrates (such as BGA, CSP, FC). This includes copper clad laminates, insulating materials, inks, dry films, photoresists, chemical solutions, surface treatment agents, etc. Also showcasing PCB design software, CAM/CAE tools, automated production equipment, drilling machines, exposure machines, laminators, plating equipment, etching equipment, AOI (Automated Optical Inspection) equipment, X-ray inspection equipment, flying probe testers, etc. 2. **Electronic Packaging Technologies and Materials:** Focusing on advanced packaging technologies such as Flip Chip, Wafer Level Packaging (WLP), System-in-Package (SiP), Multi-Chip Modules (MCM), and 3D packaging. Exhibits include packaging substrates, lead frames, bonding wires, encapsulants, thermal management materials, conductive adhesives, adhesives, etc. Also showcasing wire bonders, pick-and-place machines, die bonders, molding machines, dicing machines, test handlers, and other packaging equipment. 3. **Electronic Components and Modules:** Displaying various active and passive electronic components, such as integrated circuits (ICs), sensors, connectors, resistors, capacitors, inductors, diodes, transistors, memory, microprocessors, power modules, RF modules, optoelectronic devices. Special emphasis is placed on high-reliability, miniaturized, and high-performance next-generation components. 4. **Electronic Assembly and Testing:** Covering Surface Mount Technology (SMT) equipment and processes, such as fully automatic pick-and-place machines, reflow ovens, wave soldering machines, solder paste printers, dispensing machines, AOI/SPI (Solder Paste Inspection) equipment. Additionally, it includes various functional testing equipment for electronic products, reliability testing equipment, environmental testing equipment, EMC/EMI testing equipment, and automated assembly lines and robotic solutions. 5. **Smart Manufacturing and Industry 4.0 Solutions:** Showcasing smart factory solutions in electronics manufacturing, including MES (Manufacturing Execution Systems), SCADA (Supervisory Control and Data Acquisition systems), Industrial Internet of Things (IIoT) platforms, big data analytics, artificial intelligence applications in production, robotic automation, AGV (Automated Guided Vehicles), etc., aimed at improving production efficiency and product quality. 6. **Environmental Technologies and Sustainable Development:** Focusing on environmental protection solutions in electronics manufacturing processes, such as waste treatment, water treatment, air purification, energy-saving technologies, green materials, RoHS/REACH compliance testing, etc., promoting green and sustainable development in the electronics industry. 7. **Other Related Technologies and Services:** Including Electronic Design Automation (EDA) tools, CAD/CAM software, reliability analysis services, failure analysis, technical consulting, industry publications, and professional training.

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