2026 KPCAshow International Semiconductor Circuit & Advanced Packaging Exhibition, Incheon, Korea

The 2026 KPCAshow International Semiconductor Circuit and Advanced Packaging Exhibition in Incheon, Korea, is one of the most influential professional events in the field of semiconductor circuit boards and advanced packaging in Korea and Asia, held annually in Incheon. The exhibition is organized by the Korea Printed Circuit Association (KPCA), which plays a crucial role in Korea's electronic manufacturing and semiconductor industries, possessing extensive industry resources and profound professional background. Since its inception, KPCAshow has successfully hosted numerous editions, accumulating rich exhibition experience and a good industry reputation. The exhibition's scale and influence have grown year by year, making it an important platform for upstream and downstream enterprises in the global semiconductor and electronic manufacturing supply chain to showcase the latest technologies, products, and solutions, expand international markets, and seek business opportunities. The exhibition brings together top semiconductor equipment manufacturers, material suppliers, PCB producers, IC design companies, packaging and testing service providers, as well as research institutions and industry experts from around the world. Exhibitors and visitors can not only learn about the latest technological development trends but also engage in in-depth exchanges with industry leaders to discuss the future direction of the semiconductor industry. During the exhibition, multiple high-level professional forums, technical seminars, and new product launches are usually held, providing participants with valuable opportunities to acquire cutting-edge information and enhance professional skills. KPCAshow is committed to promoting the innovation and development of semiconductor circuit board and advanced packaging technologies, contributing to the progress of the global electronic information industry.

The exhibit range of the 2026 KPCAshow International Semiconductor Circuit and Advanced Packaging Exhibition in Incheon, Korea, covers the entire industry chain of semiconductor circuit board manufacturing and advanced packaging, with extremely rich and professional content. Specifically, it includes: 1. **PCB/FPC Manufacturing Equipment and Materials**: Various equipment required for manufacturing PCBs (Printed Circuit Boards) and FPCs (Flexible Printed Circuits), such as exposure machines, etching machines, drilling machines, laminating machines, AOI (Automated Optical Inspection) equipment, electroplating equipment, screen printing machines, etc.; and related materials, such as Copper Clad Laminates (CCL), dry film, wet film, inks, solder masks, chemical agents, copper foil, fiberglass cloth, resins, etc. 2. **Semiconductor Packaging Equipment and Materials**: Various equipment required for advanced packaging technologies, such as wafer dicing machines, wire bonders, flip-chip bonders, molding machines, scribing machines, pick-and-place machines, X-ray inspection equipment, AOI inspection equipment, laser marking machines, etc.; and packaging materials, such as lead frames, bonding wires (gold, copper, silver), molding compounds, underfill epoxies, die attach adhesives, thermal interface materials, substrate materials (BT substrates, ABF substrates), etc. 3. **IC Substrate and Substrate Technology**: Manufacturing technologies and products for high-density interconnect (HDI) boards, any-layer HDI boards, packaging substrates (such as BGA, CSP, FC-BGA, SiP substrates), ceramic substrates, metal substrates, flexible substrates, and other types of IC substrates and special function substrates. 4. **Test and Measurement Equipment**: Semiconductor wafer test equipment, packaged product test equipment, probe stations, ATE (Automated Test Equipment), reliability test equipment, environmental test chambers, failure analysis equipment, high-frequency test equipment, optical inspection equipment, etc. 5. **Smart Manufacturing and Automation Solutions**: Automated production lines, robots, AGVs (Automated Guided Vehicles), MES (Manufacturing Execution Systems), SCADA (Supervisory Control and Data Acquisition systems), Industrial IoT (IIoT) solutions, big data analytics, and artificial intelligence applications for production optimization, suitable for PCB and semiconductor packaging production lines. 6. **Environmental Technology and Cleanroom Equipment**: Exhaust gas treatment equipment, wastewater treatment equipment, solid waste treatment equipment, energy-saving equipment, cleanroom equipment (such as FFUs, air filters, clean benches), anti-static products, etc. 7. **Design and Software Services**: EDA tools (Electronic Design Automation), CAD/CAM software, simulation software, PCB design services, IC design services, IP cores, etc. 8. **Surface Mount Technology (SMT)**: Pick-and-place machines, reflow soldering equipment, wave soldering equipment, solder paste printers, oven temperature profilers, AOI/SPI (Solder Paste Inspection) equipment, SMT peripheral equipment and consumables, etc. 9. **Other Related Technologies and Services**: Such as laser technology applications in electronic manufacturing, nanotechnology, material analysis, technical consulting, industry publications, and media. The exhibit range comprehensively covers the entire semiconductor circuit and advanced packaging industry chain, from design, manufacturing, and packaging to testing, providing a comprehensive display and exchange platform for exhibitors and visitors.

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