2026 Motek Production and Assembly Automation and Bondexpo Bonding Technology Exhibition, Stuttgart, Germany

The 2026 Motek Production and Assembly Automation and Bondexpo Bonding Technology Exhibition in Stuttgart, Germany, a significant event in industrial manufacturing, will be grandly held from October 6th to 8th, 2026, at the internationally renowned Stuttgart Exhibition Centre. Motek focuses on production and assembly automation technology, serving as a leading global platform for showcasing automation solutions, systems, and components, covering the entire industrial process from component production to final product assembly. Bondexpo, on the other hand, specializes in industrial bonding technology, and is one of the most influential professional exhibitions in the bonding technology sector in Europe and globally, bringing together the latest bonding materials, equipment, and application solutions. The two exhibitions, held concurrently at the same venue, create powerful synergies, offering exhibitors and visitors a unique opportunity to comprehensively understand and experience the cutting-edge developments in industrial automation and bonding technology. The exhibition aims to promote smart manufacturing, Industry 4.0, and digital transformation, attracting professionals from various industries such as automotive, mechanical engineering, electronics, medical technology, and aerospace. Exhibitor types include manufacturers of automation equipment, robotics technology suppliers, vision system developers, adhesive producers, bonding equipment suppliers, and related service providers. The target audience includes production managers, engineers, R&D personnel, buyers, technical experts, and decision-makers, who will seek innovative solutions, establish business contacts, and understand industry trends here. A series of professional forums, seminars, and technical demonstrations will also be held during the exhibition, building a high-value platform for industry exchange and knowledge sharing.

Motek Production and Assembly Automation exhibit range: assembly technology and systems, including manual, semi-automatic, and fully automatic assembly equipment, assembly workstations; handling technology, such as industrial robots, collaborative robots, AGVs, conveyor systems, gripping systems; drive technology, including motors, reducers, pneumatic and hydraulic components; control technology, such as PLCs, sensors, industrial PCs, human-machine interfaces; testing and quality control systems, such as vision inspection systems, measuring equipment, non-destructive testing; industrial software, including MES, SCADA, CAD/CAM, simulation software; safety technology, such as safety light curtains, safety relays; component supply, such as fasteners, connectors, seals. Bondexpo Bonding Technology exhibit range: various adhesives and sealants, including epoxy resins, polyurethanes, acrylics, silicones, hot melts, UV-curable adhesives; bonding equipment and systems, such as dispensing equipment, coating machines, mixing equipment, curing equipment, surface treatment equipment; bonding materials, such as tapes, films, gaskets; bonding processes and technologies, such as automated bonding, robotic bonding, laser bonding, ultrasonic bonding; bonding quality inspection and testing equipment, such as viscometers, tensile testers, shear strength testers; related auxiliary materials and services, such as cleaning agents, primers, mold release agents, consulting services.

No fee information available. Please contact us for a quote.