SEMICON JAPAN

SEMICON JAPAN, the Japan Tokyo International Semiconductor Exhibition, is one of the most influential events in the global semiconductor industry, held annually in Tokyo, Japan. With a long history since its inception, the exhibition has always been dedicated to promoting the development of semiconductor technology and industry. As an international exhibition for the electronic manufacturing supply chain, SEMICON JAPAN comprehensively covers the latest advancements in semiconductor manufacturing technology, equipment, and materials, and delves into the innovative integration of semiconductors in smart applications such as automotive and IoT devices. The exhibition is grand in scale, attracting tens of thousands of professional visitors and hundreds of exhibiting companies each year, including numerous industry giants and emerging technology enterprises. SEMICON JAPAN is not only a platform for showcasing cutting-edge products and solutions but also an important bridge for promoting industry exchange, technological cooperation, and market expansion. The co-located "Advanced Packaging and Chiplet Summit (APCS)" brings together leading manufacturers and experts in semiconductor packaging and substrate assembly to discuss future technology trends, further enhancing the professionalism and influence of the exhibition. SEMICON JAPAN has become an unmissable annual event for global semiconductor industry professionals, playing a crucial role in promoting global digital transformation and smart technology development.

Semiconductor equipment: wafer manufacturing equipment, packaging equipment, testing equipment, cleanroom equipment, automation equipment, inspection and metrology equipment; semiconductor materials: silicon wafers, photoresists, electronic gases, high-purity chemicals, targets, packaging materials, lead frames, bonding wires; integrated circuit design and manufacturing: IC design, IP cores, foundry services, EDA tools; advanced packaging technology: Chiplet, heterogeneous integration, 3D packaging, fan-out packaging, flip-chip packaging; MEMS and sensors: various sensors, MEMS device manufacturing technology; smart applications: automotive electronics, Internet of Things (IoT) devices, artificial intelligence (AI) chips, 5G communication, consumer electronics; software and services: semiconductor design software, manufacturing execution systems (MES), quality control systems, testing services, consulting services.

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