ADHESION & BONDING EXPO - OSAKA

ADHESION & BONDING EXPO - OSAKA, the International Adhesion & Bonding Technology Exhibition in Osaka, is one of the most influential international trade exhibitions in the field of industrial adhesion and bonding technology in Japan and Asia. Held annually at Intex Osaka in Osaka, Japan, it brings together top global suppliers and manufacturers of adhesives, bonding equipment, bonding technologies, and related solutions. As a major event in the industrial manufacturing sector, the Osaka International Adhesion & Bonding Technology Exhibition is dedicated to showcasing the latest adhesion and bonding technological achievements and promoting industry innovation and development. The exhibition is large in scale, attracting tens of thousands of professional visitors from around the world, including R&D engineers, purchasing managers, technical experts, and corporate decision-makers from various industries such as automotive, electronics, aerospace, medical devices, construction, and packaging. The exhibition not only provides a platform for product display and technical exchange but also, through a series of high-end forums, technical seminars, and on-site demonstrations, delves into industry trends, market opportunities, and challenges. Exhibiting companies can effectively expand their markets, establish cooperative relationships, and enhance brand influence through the exhibition. The exhibition's influence is not only reflected in its extensive international participation but also in its crucial role in promoting technological progress and industrial upgrading in the manufacturing sector. Whether seeking innovative solutions as end-users or wishing to showcase the latest technologies as suppliers, the Osaka International Adhesion & Bonding Technology Exhibition is an unmissable industry event.

The exhibition scope of ADHESION & BONDING EXPO - OSAKA covers all aspects of industrial adhesion and bonding technologies, aiming to provide visitors with one-stop solutions. Exhibits primarily include: various adhesives and sealants, such as epoxy adhesives, polyurethane adhesives, acrylic adhesives, silicone adhesives, hot melt adhesives, UV-curable adhesives, anaerobic adhesives, structural adhesives, conductive adhesives, thermally conductive adhesives, bio-based adhesives, pressure-sensitive tapes, film adhesives, etc., as well as various sealing materials and tape products. In terms of bonding technologies, exhibits cover a range of traditional to advanced bonding processes and equipment, such as: welding equipment (including laser welding, arc welding, resistance welding, friction welding, ultrasonic welding, electron beam welding, plasma welding, etc.), brazing and soldering equipment, diffusion bonding technology, riveting equipment, bolt fastening systems, mechanical fasteners, and various automated assembly and bonding systems. Additionally, the exhibition also showcases auxiliary materials and equipment for adhesion and bonding processes, such as surface treatment equipment (plasma treatment, corona treatment, flame treatment, primers, cleaning agents, etc.), dispensing equipment, coating equipment, curing equipment (UV curing lamps, ovens, etc.), and inspection and testing equipment (viscometers, peel strength testers, shear strength testers, fatigue testers, non-destructive testing equipment, etc.). At the same time, the exhibition also focuses on the latest R&D achievements and applications in adhesion and bonding technologies, including smart adhesion systems, robotic automated bonding solutions, composite material bonding technologies, microelectronics packaging technologies, medical device bonding technologies, and environmentally friendly adhesives and processes, providing comprehensive technical support and innovative solutions for various fields of industrial manufacturing.

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