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FINE PROCESS TECHNOLOGY EXPO JAPAN - OSAKA1
日本大阪精密加工技术展览会
5/13/2026 - 5/15/2026
日本 大阪
Intex Osaka
Frequency: once a year
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Introduction
FINE PROCESS TECHNOLOGY EXPO JAPAN - OSAKA, the Precision Processing Technology Exhibition in Osaka, Japan, is a major event for precision processing technology in the electronic manufacturing sector in Japan and Asia. Held annually at Intex Osaka International Exhibition Center in Osaka, Japan, it brings together leading global precision processing technology suppliers, equipment manufacturers, and electronic product manufacturers. With a long history, the exhibition has been dedicated for years to promoting innovation and development in electronic manufacturing processes, providing an efficient platform for exchange and cooperation among industry professionals. Its scale is grand, attracting tens of thousands of professional visitors and hundreds of exhibitors each year, covering various precision processing technologies from micron to nano scale. The exhibition has far-reaching influence, serving not only as a platform for new product and technology releases but also as a barometer for industry trends, playing a crucial role in improving the performance of electronic products, reducing production costs, and increasing production efficiency. Key exhibitor groups include precision mold manufacturers, cutting equipment suppliers, stamping technology service providers, etching process solution providers, surface treatment experts, and various electronic component and module manufacturers. Through on-site demonstrations, technical seminars, and business negotiations, exhibitors can fully showcase their latest technological achievements and solutions, while professional visitors can gain in-depth knowledge of cutting-edge industry trends and find suitable partners to jointly promote the progress of the electronic manufacturing industry.
Exhibit Scope
The exhibition scope of FINE PROCESS TECHNOLOGY EXPO JAPAN - OSAKA is extremely extensive, covering various precision processing technologies and equipment required in electronic manufacturing processes. This includes, but is not limited to: precision molding technologies and equipment, such as injection molding machines, compression molding machines, extrusion molding machines, and molds and auxiliary equipment for producing high-precision plastic and metal components like connectors, casings, and optical elements; high-precision cutting technologies and equipment, including laser cutting machines, waterjet cutting machines, wire cutting machines, ultrasonic cutting machines, and various precision tools and abrasives, suitable for precision cutting of materials such as PCBs, semiconductor wafers, and display panels; precision stamping technologies and equipment, such as high-speed stamping machines, multi-station stamping machines, fine blanking dies, progressive dies, used for producing metal stamped parts for various electronic components; advanced etching technologies and equipment, including wet etching, dry etching (plasma etching), photoresists, developers, widely used in semiconductor manufacturing, PCB manufacturing, MEMS device manufacturing, etc.; surface treatment technologies, such as electroplating, electroless plating, PVD/CVD coating, anodizing, polishing, cleaning equipment and materials, used to improve the conductivity, corrosion resistance, and aesthetics of electronic components; micro-assembly and packaging technologies, including chip mounters, wire bonders, flip-chip bonders, dispensing machines, die bonders, and packaging materials; inspection and measurement equipment, such as optical microscopes, electron microscopes, coordinate measuring machines, X-ray inspection equipment, spectrometers, film thickness gauges, etc., to ensure product quality and process accuracy; automation and robotics technologies, used to improve production efficiency and automation levels; and various precision processing auxiliary materials and consumables, such as special alloys, engineering plastics, ceramic materials, grinding fluids, cutting fluids, etc. These exhibits collectively form a comprehensive overview of precision processing technologies in the electronic manufacturing sector, providing comprehensive solutions for industry development.
Exhibition Fees
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Record updated: Jun 12, 2026Correction policy
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